Advanced engineering components require not only better materials but also new joining or welding processes. Recently, diffusion bonding has become a viable process in the fabrication of structural hardware or fluid and gas flow devices for aerospace and electronic industries. This technology heats and applies pressure on joint materials and uses molecular diffusion to bond them. This means that the resulting joint has properties similar or equal to the parent materials. The process has the ability to produce high quality titanium joints so that neither metallurgical discontinuities nor porosity exist across the interface.

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